Power Tools

Precision Blade Dicing Saw for 8" Wafer Cutting (DS830)

Nanjing Wotian Technology Co., Ltd.
  • Application:Silicon, PCB, Ceramic, Glass, Lithium Niobate, etc
  • Type:Fixed
  • Power Source:Servo Motor+Step Motor+Dd Motor
  • Customized:Customized
  • Condition:New
  • Workpiece Size:Φ200mm 180mm (for Square)

Base Info

  • Model NO.:DS830
  • Groove Depth:≤4mm or Customize
  • Alignment System:80X Straight Light + Ring Light (40X 210X Optional
  • Spindle: Revolution Speed Range:10000~50000 Rpm
  • Spindle: Output Power:1.5kw (2.2kw Optional)
  • X Axis: Feed Speed Range:0.1~400mm,S
  • Y Axis: Single-Step Accuracy:≤0.003mm,5mm
  • Z Axis: Repeatability Accuracy:0.002mm
  • Power Supply:Single Phase, AC220V±10%
  • Power Consumption:0.9kw (Processing); 0.8kw (Warming up)
  • Transport Package:Standard Export Packing
  • Specification:775mm× 960mm× 1650mm; 600kg
  • Origin:China
  • HS Code:84862090
  • Production Capacity:200+ Sets,Year

Description

Power consumption0.9kW (processing)0.8kW (warming up)Compressed airPressure: 0.55~0.8Mpa; average flow rate: 350L/minCleaning water Pressure: 0.2~0.4Mpa; flow rate 3.0L/minCooling waterPressure: 0.2~0.4Mpa; flow rate 1.5L/min Exhaust air rate1.8m3/min (ANR)Overall dimensions W×D×H775mm×960mm×1650 mmWeight 600kg 
Environmental Conditions
 

• Use clean, oil-free air (dew point below -15, residual oil: 0.1 ppm, and filtration rating: 0.01μm/99.5 % or more).
• Keep room temperature fluctuations within ±1ºC of the set value (Set value should be between 20ºC - 25ºC), indoor humidity no more than 80% and no condensation.
• Keep cutting water and cleaning water 2ºC above room temperature (fluctuations within ±1ºC). Keep temperature of cooling water the same as room temperature.
• The machines should be used in an environment, free from external vibration. Do not install machine near a ventilation opening, heat generation equipment or oil mist generating parts.
• This machine uses water. In case of water leakage, please install the machine on the floor with sufficient waterproofing and drainage treatments.
Please follow the product manual of our company.

About US:

Precision Blade Dicing Saw for 8" Wafer Cutting (DS830)
Precision Blade Dicing Saw for 8" Wafer Cutting (DS830)
Precision Blade Dicing Saw for 8" Wafer Cutting (DS830)

Certifications:
Precision Blade Dicing Saw for 8" Wafer Cutting (DS830)