Power Tools

Precision Dicing Saw for Wafer Cutting 6 Inch Ds616

Nanjing Wotian Technology Co., Ltd.
  • Application:Silicon, Gallium Arsenide, Ceramic, Glass, Alumina
  • Type:Fixed
  • Power Source:Servo Motor+Step Motor
  • Condition:New
  • Workpiece Size:Φ6’’ ≤160mm X 160mm
  • Groove Depth:≤4mm

Base Info

  • Model NO.:Dicing Saw DS616
  • Alignment System:70X Straight Light + Ring Light(210X Optional)
  • Spindle: Revolution Speed Range:3000~40000 Rpm
  • Spindle: Output Power:1.5kw
  • X Axis: Feed Speed Range:0.1~400mm,S
  • Y Axis: Single-Step Accuracy:≤0.003mm,5mm
  • Z Axis: Repeatability Accuracy:0.002mm
  • Power Supply:Single Phase, AC220V±10%
  • Power Consumption:0.8kw (Processing); 0.7kw (Warming up)
  • Transport Package:Standard Export Packing
  • Specification:665mm× 850mm× 1650 mm; 500kg
  • Origin:China
  • HS Code:84862090
  • Production Capacity:200+ Sets,Year

Description

Power consumption0.8kW (processing)
0.7kW (warming up)
Compressed airPressure: 0.55~0.8Mpa; average flow rate: 350L/min
Cleaning water Pressure: 0.2~0.4Mpa; flow rate: 3.0L/min
Cooling waterPressure: 0.2~0.4Mpa; flow rate: 1.5L/min
Exhaust air rate2m3/min (ANR)
Overall dimensions W×D×H665mm×850mm×1650 mm
Weight 500kg
 
Environmental Conditions
 
• Use clean, oil-free air (dew point below -15ºC, residual oil: 0.1 ppm, and filtration rating: 0.01μm/99.5 % or more).
• Keep room temperature fluctuations within ±1ºC of the set value (Set value should be between 20ºC - 25ºC), indoor humidity no more than 80% and no condensation.
• Keep cutting water 2ºC above room temperature (fluctuations within ±1ºC). Keep temperature of cooling water the same as room temperature (fluctuations within ±1ºC).
• The machines should be used in an environment, free from external vibration. Do not install machine near a ventilation opening, blower, heat generation equipment or oil mist generating parts.
• Please install the machine on the floor with sufficient waterproofing and drainage treatments.
Please follow the product manual of our company.
About Us:
Precision Dicing Saw for Wafer Cutting 6 Inch Ds616


Precision Dicing Saw for Wafer Cutting 6 Inch Ds616


Precision Dicing Saw for Wafer Cutting 6 Inch Ds616

Certifications:
Precision Dicing Saw for Wafer Cutting 6 Inch Ds616


FAQ:
1.    Q: Are you manufacturer or trading company?
        A: We are manufacturer which focuses on pressure sensor for 33 years.
2.    Q: What international certificates do you have?
        A: ISO9001, CE, RoHS Certificated.
3.    Q: What is your production capacity?
        A: We produced 1500000 pieces pressure sensor in year 2017.
4.    Q: What is the lead time of your product?
        A: Stocks are available for some products. The typical lead time is 8~14 working days for product without customization. 
       Note: lead time may vary base on different products. Please contact us for detailed lead time. 
5.    Q: What is the warranty of your products?
       A: Our warranty time is 18 months after shipment.
6.    Q: Do you provide customized products?
       A: Yes, we can laser mark your logo, model and product information according to your requirement. We provide OEM and ODM service.