Precision Dicing Saw for Wafer Cutting of 6" Inch (DS616)
Nanjing Wotian Technology Co., Ltd.- Application：Silicon, Gallium Arsenide, Ceramic, Glass, Alumina
- Type：Fixed
- Power Source：Servo Motor+Step Motor
- Condition：New
- Workpiece Size：Φ6’’ ≤160mm X 160mm
- Groove Depth：≤4mm
Base Info
- Model NO.：DS616
- Alignment System：70X Straight Light + Ring Light(210X Optional)
- Spindle: Revolution Speed Range：3000~40000 Rpm
- Spindle: Output Power：1.5kw
- X Axis: Feed Speed Range：0.1~400mm,S
- Y Axis: Single-Step Accuracy：≤0.003mm,5mm
- Z Axis: Repeatability Accuracy：0.002mm
- Power Supply：Single Phase, AC220V±10%
- Power Consumption：0.8kw (Processing); 0.7kw (Warming up)
- Transport Package：Standard Export Packing
- Specification：665mm× 850mm× 1650 mm; 500kg
- Origin：China
- HS Code：84862090
- Production Capacity：200+ Sets,Year
Description
| Power consumption | 0.8kW (processing) |
| 0.7kW (warming up) | |
| Compressed air | Pressure: 0.55~0.8Mpa; average flow rate: 350L/min |
| Cleaning water | Pressure: 0.2~0.4Mpa; flow rate: 3.0L/min |
| Cooling water | Pressure: 0.2~0.4Mpa; flow rate: 1.5L/min |
| Exhaust air rate | 2m3/min (ANR) |
| Overall dimensions W×D×H | 665mm×850mm×1650 mm |
| Weight | 500kg |
| Environmental Conditions |
• Keep room temperature fluctuations within ±1ºC of the set value (Set value should be between 20ºC - 25ºC), indoor humidity no more than 80% and no condensation.
• Keep cutting water 2ºC above room temperature (fluctuations within ±1ºC). Keep temperature of cooling water the same as room temperature (fluctuations within ±1ºC).
• The machines should be used in an environment, free from external vibration. Do not install machine near a ventilation opening, blower, heat generation equipment or oil mist generating parts.
• Please install the machine on the floor with sufficient waterproofing and drainage treatments.
• Please follow the product manual of our company.
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