Power Tools

Precision Blade Dicing Saw for 8", 6" Wafer Cutting Ds830

Nanjing Wotian Technology Co., Ltd.
  • Application:Silicon, PCB, Ceramic, Glass, Lithium Niobate, etc
  • Type:Fixed
  • Power Source:Servo Motor+Step Motor+Dd Motor
  • Customized:Customized
  • Condition:New
  • Workpiece Size:Φ200mm 180mm (for Square)

Base Info

  • Model NO.:DS830
  • Groove Depth:≤4mm or Customize
  • Alignment System:80X Straight Light + Ring Light (40X 210X Optional
  • Spindle: Revolution Speed Range:10000~50000 Rpm
  • Spindle: Output Power:1.5kw (2.2kw Optional)
  • X Axis: Feed Speed Range:0.1~400mm,S
  • Y Axis: Single-Step Accuracy:≤0.003mm,5mm
  • Z Axis: Repeatability Accuracy:0.002mm
  • Power Supply:Single Phase, AC220V±10%
  • Power Consumption:0.9kw (Processing); 0.8kw (Warming up)
  • Transport Package:Standard Export Packing
  • Specification:775mm× 960mm× 1650mm; 600kg
  • Origin:China
  • HS Code:84862090
  • Production Capacity:200+ Sets,Year

Description

Power consumption0.9kW (processing)0.8kW (warming up)Compressed airPressure: 0.55~0.8Mpa; average flow rate: 350L/minCleaning water Pressure: 0.2~0.4Mpa; flow rate 3.0L/minCooling waterPressure: 0.2~0.4Mpa; flow rate 1.5L/min Exhaust air rate1.8m3/min (ANR)Overall dimensions W×D×H775mm×960mm×1650 mmWeight 600kg 
Environmental Conditions
 

• Use clean, oil-free air (dew point below -15, residual oil: 0.1 ppm, and filtration rating: 0.01μm/99.5 % or more).
• Keep room temperature fluctuations within ±1ºC of the set value (Set value should be between 20ºC - 25ºC), indoor humidity no more than 80% and no condensation.
• Keep cutting water and cleaning water 2ºC above room temperature (fluctuations within ±1ºC). Keep temperature of cooling water the same as room temperature.
• The machines should be used in an environment, free from external vibration. Do not install machine near a ventilation opening, heat generation equipment or oil mist generating parts.
• This machine uses water. In case of water leakage, please install the machine on the floor with sufficient waterproofing and drainage treatments.
Please follow the product manual of our company.
About Us:
Precision Blade Dicing Saw for 8", 6" Wafer Cutting Ds830

Precision Blade Dicing Saw for 8", 6" Wafer Cutting Ds830
Precision Blade Dicing Saw for 8", 6" Wafer Cutting Ds830
Precision Blade Dicing Saw for 8", 6" Wafer Cutting Ds830
Certifications:
Precision Blade Dicing Saw for 8", 6" Wafer Cutting Ds830



FAQ:
1.    Q: Are you manufacturer or trading company?
        A: We are manufacturer which focuses on pressure sensor for 33 years.
2.    Q: What international certificates do you have?
        A: ISO9001, CE, RoHS Certificated.
3.    Q: What is your production capacity?
        A: We produced 1500000 pieces pressure sensor in year 2017.
4.    Q: What is the lead time of your product?
        A: Stocks are available for some products. The typical lead time is 8~14 working days for product without customization. 
       Note: lead time may vary base on different products. Please contact us for detailed lead time. 
5.    Q: What is the warranty of your products?
       A: Our warranty time is 18 months after shipment.
6.    Q: Do you provide customized products?
       A: Yes, we can laser mark your logo, model and product information according to your requirement. We provide OEM and ODM service.